C
ambridge
J
oining
T
echno
logy
Developing New Methods for Diffusion Bonding Alloys and Ceramics
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Joining Copper to Aluminum
for Electrical and Thermal Device
Diffusion bonded copper / aluminium plates withstood 3000 thermal cycles
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Diffusion Bonding Superalloys
Diffusion Bonding Aluminum Alloys
High precision Bonding Microwave-Guides
Diffusion Bonding Titanium Alloys
Diffusion Bonding Aluminum to Titanium
Joining Copper to Aluminum
Diffusion Bonding Aluminum to Steel
Solid-State Bonding Medical Devices
Diffusion Bonding Metals to Ceramics
Videos (new methods & applications)
Farnborough Airshow-UK 15 July 2016
